Nanopackaging TC

Nanopackaging Technical Committee (TC 11)

The mission of the Nano Committee is to be the focal point for dissemination of technical advances and applications of nanotechnology for electronic packaging applications. As systems move to heterogenous integration for achieving the functional density, miniaturization, power and bandwidth requirements, nanopackaging of system components in thin modules becomes extremely critical. This affects all the applications: computing, power, 5G-6G and THz communications, sensing for healthcare and security. Nanopackaging provides solutions to achieve new component functions and their integration to realize future complex systems. To these ends, Nanopackaging TC will nurture the application of nanotechnologies to electronics packaging in IEEE EPS and NTC. Focus: materials, structures, functions, or processes of dimensions less than 100nm, e.g. nanoparticles, CNTs, nanowires, graphene, etc, for cooling, interconnect, mechanical enhancement, fabrication, etc.

Note: The Nanotechnology Council Nanopackaging TC, the EPS Nanotechnology TC, and the NANO conference Nanopackaging program committee operate as one committee.

Visit the EPS Nanopackaging TC website here.