Vision & Strategy

The mission of the Nano Committee is to be the focal point for dissemination of technical advances and applications of nanotechnology for electronic packaging applications. As systems move to heterogenous integration for achieving the functional density, miniaturization, power and bandwidth requirements, nanopackaging of system components in thin modules becomes extremely critical. This affects all the applications: computing, power, 5G-6G and THz communications, sensing for healthcare and security. Nanopackaging provides solutions to achieve new component functions and their integration to realize future complex systems. To these ends, Nanopackaging TC will nurture the application of nanotechnologies to electronics packaging in IEEE EPS and NTC. Focus: materials, structures, functions, or processes of dimensions less than 100nm, e.g. nanoparticles, CNTs, nanowires, graphene, etc, for cooling, interconnect, mechanical enhancement, fabrication, etc.

Note: The Nanotechnology Council Nanopackaging TC, the EPS Nanotechnology TC, and the NANO conference Nanopackaging program committee operate as one committee.

Visit the EPS Nanopackaging TC website.

Leadership

NameAffiliationEmail
Chair
Markondeya Raj PulugurthaFlorida International Universitympulugur@fiu.edu
Co-Chair(s)
Jian CaiTsinghua Universityjamescai@tsinghua.edu.cn
Members
James MorrisPortland Statejmorris@pdx.edu
Jian CaiTsinghua Universityjamescai@tsinghua.edu.cn
Christopher BaileyGreenwich UKC.Bailey@greenwich.ac.uk
Karlhienz BockTU-Dresdenkarlheinz.bock@tu-dresden.de
Maria Bylund Smoltekmaria.bylund@smoltek.com
Atom Watanabe Qualcommatomwat@qti.qualcomm.com
Goren MiskovicSilicon Austriagoran.miskovic@silicon-austria.com
Maria Vesna-Nikolic University of Belgrademariavesna@imsi.rs
Liangxing HuNanyang Technological University, SingaporeLHU001@e.ntu.edu.sg
Madalin MoisePolytech. Bucharestmadalin.moise@cetti.ro
Karan R BhangaonkarIntelkaran.r.bhangaonkar@intel.com
Vidya JayaramIntelvidya.jayaram@intel.com
Srikrisha SitaramanApplied Materialssrikrishna.sitaraman@gmail.com
Alfred ZinnKuprion Incalfred.zinn@kuprioninc.com
Antonio MaffucciUniversity of Cassino and Southern Laziomaffucci@unicas.it
18 Feb-26