Vision & Strategy
The scope of this TC is to serve as an interdisciplinary guide for scientists working in Semiconductor Packaging Process, Equipment, materials, substrates, Design, and EDA with the main goal to bring researchers of these different communities to create a common language and ecosystem for chiplets.
Topics of Interest
2.5D and 3D integration, interposer-based integration, die to wafer, wafer to wafer and die-to-die bonding, Chiplet Design, thermal management, power delivery, signal integrity, software/hardware co-design, System Technology Co-optimization (STCO). CPUs, GPUs, networking chips, AI accelerators.
Objectives
Promotion of technological innovation and excellence in chiplet and the ecosystem surrounding chiplets such as substrate, equipment, materials, Design, EDA for facing societal challenges through participations in NTC conferences, publications and other outreach and education activities. Moreover, we also emphasize global collaboration and engagement.
Leadership
| Name | Affiliation | |
|---|---|---|
| Chair | ||
| Moitreyee Mukherjee-Roy | IBM Research, USA | mukherjm@us.ibm.com |
| Co-Chair(s) | ||
| Pedram Khalili Amiri | Northwestern University, USA | pedram@northwestern.edu |
| Members | ||
| Shaahin Angizi | New Jersey Institute of Technology | shaahin.angizi@njit.edu |
| Nilesh Badwe | IIT Kanpur, India | nbadwe@iitk.ac.in |
| Veeresh Deshpande | IIT Bombay | veeresh@iitb.ac.in |
| Isabel Desouza | IBM, Bromont, Canada | idesousa@ca.ibm.com |
| Giovanni Finocchio | University of Messina | gfinocchio@unime.it |
| Siping Gao | Nanjing Univ of Aeronautics& Astronautics | gao.sp@nuaa.edu.cn |
| Williamson Jaimal | Texas Instruments | Jaimal@ti.com |
| Tae-Hyeon Kim | Seoul National Univ. of Science and Technology | taehyeon@seoultech.ac.kr |
| Weiqiang Liu | Nanjing University of Aeronautics and Astronautics, Nanjing | liuweiqiang@nuaa.edu.cn |
| Mahdi Nikdast | Colorado State University | Mahdi.Nikdast@colostate.edu |
| Rob Pelt | AMD Fellow | Robert.Pelt@amd.com |
| Anu Ramamurthy | Associate Fellow - Design, Microchip Technology | Anu.Ramamurthy@microchip.com |
| Srikanth Rangarajan | University of Binghampton | srangar@binghamton.edu |
| Arman Roohi | University of Illinois Chicago | aroohi@uic.edu |
| Nader Sehatbakhsh | University of California, Los Angeles | nsehat@ucla.edu |
| Updated 05/22/26 | ||
