Heterogenous Integration and Chiplets TC

Heterogenous Integration and Chiplets TC 19

The scope of this TC is to serve as an interdisciplinary guide for scientists working in Semiconductor Packaging Process, Equipment, materials, substrates, Design, and EDA with the main goal to bring researchers of these different communities to create a common language and ecosystem for chiplets.

Topics of Interest

2.5D and 3D integration, interposer-based integration, die to wafer, wafer to wafer and die-to-die bonding, Chiplet Design, thermal management, power delivery, signal integrity, software/hardware co-design, System Technology Co-optimization (STCO). CPUs, GPUs, networking chips, AI accelerators.

Main Objectives of Technical Committee

Promotion of technological innovation and excellence in chiplet and the ecosystem surrounding chiplets such as substrate, equipment, materials, Design, EDA for facing societal challenges through participations in NTC conferences, publications and other outreach and education activities. Moreover, we also emphasis on global collaborations, inclusion, and diversity.