IEEE Nanotechnology Council
Advancing Nanotech for Humanity

IEEE-NANO 2023 Call for Papers

23rd IEEE International Conference on Nanotechnology (IEEE-NANO 2023)

July 2-5, 2023, Jeju, Korea.


Download Call for Papers

IEEE-NANO is the flagship conference series of the IEEE Nanotechnology Council (NTC) since 2001, focusing on the promotion of advanced research in the fields of nanoscience and nanotechnology. Recent conferences were held in Palma de Mallorca (Spain, 2022), Montreal (Canada, 2021), Virtual (2020), Macau (China, 2019), Cork (Ireland, 2018), Pittsburgh (USA, 2017), Sendai (Japan, 2016), Rome (Italy, 2015), Toronto (Canada, 2014), etc.

Conference Scope

We invite contributions describing the latest scientific and technological research results in subjects including, but not limited to:

• Nanorobotics & Nanomanufacturing
• Nanobiomedicine
• Nanofabrication
• Nano-Optics, Nanophotonics & Nano-optoelectronics
• Spintronics
• Nanoelectronics
• Nanosensors & Nanoactuators
• Nanomaterials
• Nano-Metrology & Characterization
• Modeling & Simulation
• Nanopackaging
• Nanomagnetics
• Nano-energy, Environment & Safety
• Nanoscale Communications
• Nano-Acoustic Devices, Processes & Materials
• Quantum, Neuromorphic & Unconventional Computing
• Emerging Plasma Nanotechnologies
• Special Sessions

Key Dates:

Paper Submissions Opening: January 15, 2023
Deadline for Paper Submissions: March 15, 2023
Notification of Acceptance: April 15, 2023
Camera-Ready Submission: May 15, 2023

Accepted full papers (4-6 pages) for IEEE-NANO will be submitted for inclusion into IEEE Xplore with their acceptances.

Special Sessions:

Special Invited Session Proposal Deadline: March 15, 2023
Special Invited Session Abstract/Paper Submission Deadline: April 30, 2023

Special Issues

Papers presented at IEEE-NANO 2023 will be selected to publish in special issues of peer-reviewed journals:

Visit for further details

General Chairs:

Jin-Woo Kim, Univ. of Arkansas, USA
Chang-Ki Baek, POSTECH, Korea

Program Chairs:

John T.W. YEOW, Univ. of Waterloo, Canada
Byoung-Don KONG, POSTECH, Korea


Comments are closed.